Electrical engineering PhD student Saivineeth Penukula holds up a chip in a clean room at the ASU MacroTechnology Works Building in Tempe on July 28, 2025. Photo by Samantha Chow/Arizona State University

Researchers Race to Close the Packaging Gap to Fully Native U.S. Chips

Offshore advanced chip packaging could introduce hidden dependencies, expose sensitive design, and limit the United States’ development of advanced artificial
February 27, 2026

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